Pressure transfer process for thin film solar cell fabrication

ABSTRACT

In one aspect, a method for fabricating a thin film solar cell includes the following steps. A first absorber material is deposited as a layer A on a substrate while applying pressure to the substrate/layer A. A second absorber material is deposited as a layer B on layer A while applying pressure to the substrate/layer B. A third absorber material is deposited as a layer C on layer B while applying pressure to the substrate/layer C. A fourth absorber material is deposited as a layer D on layer C while applying pressure to the substrate/layer D. The first absorber material comprises copper, the second absorber material comprises indium, the third absorber material comprises gallium, and the fourth absorber material comprises one or more of sulfur and selenium, and wherein by way of performing the steps of claim  1  a chalcogenide absorber layer is formed on the substrate.

FIELD

The present invention relates to the fabrication ofcopper-indium-gallium-sulfur/selenium (CIGS)-based thin film solar cellsand more particularly, to techniques for fabricating CIGS-based thinfilm solar cells that employ a pressure transfer process to controlvolume expansion and stresses on the CIGS layers that occur during thefabrication process and thereby prevent loss of adhesion between thelayers.

BACKGROUND

Copper-indium-gallium-sulfur/selenium (CIGS) materials are commonly usedas the absorber in thin film solar cells. One approach to producing aCIGS absorber in thin film solar cell technology is to successivelydeposit elemental layers of the copper, indium, gallium and sulfur,followed by an annealing step (for example in a selenium environment).

One challenge in this fabrication process is to maintain adhesionbetween the deposited layers. Namely, the layers being formed fromdifferent materials will have different coefficients of thermalexpansion. During the heating and cooling cycles of absorberfabrication, the differing amounts of volume expansion can cause thelayers to delaminate. This delamination problem is a significantroadblock to large-scale implementation of CIGS thin film solar cellproduction.

Thus, techniques for fabricating CIGS thin film solar cells thatminimize or eliminate such adhesion problems would be desirable.

BRIEF SUMMARY

The present invention provides techniques for fabricating CIGS-basedthin film solar cells that employ a pressure transfer process to controlvolume expansion and stresses on the CIGS layers that occur during thefabrication process and thereby prevent loss of adhesion between thelayers. In one aspect of the invention, a method for fabricating a thinfilm solar cell is provided. The method includes the following steps. Asubstrate is provided. A first absorber material is deposited as a layerA on the substrate while applying pressure to both the substrate and thelayer A. A second absorber material is deposited as a layer B on thelayer A while applying pressure to both the substrate and the layer B. Athird absorber material is deposited as a layer C on the layer B whileapplying pressure to both the substrate and the layer C. A fourthabsorber material is deposited as a layer D on the layer C whileapplying pressure to both the substrate and the layer D. The layers A-Dare annealed while applying pressure to both the substrate and the layerD, wherein the first absorber material comprises copper, the secondabsorber material comprises indium, the third absorber materialcomprises gallium, and the fourth absorber material comprises one ormore of sulfur and selenium, and wherein by way of performing the stepsof the method a chalcogenide absorber layer is formed on the substrate.

In another aspect of the invention, an apparatus for fabricating a thinfilm solar cell is provided. The apparatus includes a set of rollers (a)configured to, when a substrate passes between the set of rollers (a),deposit a first absorber material as a layer A on the substrate whileapplying pressure to both the substrate and the layer A; a set ofrollers (b) configured to, when the substrate with the layer A thereonpasses through the set of rollers (b), deposit a second absorbermaterial as a layer B on the layer A while applying pressure to both thesubstrate and the layer B; a set of rollers (c) configured to, when thesubstrate with the layers A and B thereon passes through the set ofrollers (c), deposit a third absorber material as a layer C on the layerB while applying pressure to both the substrate and the layer C; a setof rollers (d) configured to, when the substrate with the layers A-Cthereon passes through the set of rollers (d), deposit a fourth absorbermaterial as a layer D on the layer C while applying pressure to both thesubstrate and the layer D; and a set of rollers (e) configured to, whenthe substrate with the layers A-D thereon passes through the set ofrollers (e), anneal the layers A-D while applying pressure to both thesubstrate and the layer D, wherein the first absorber material comprisescopper, the second absorber material comprises indium, the thirdabsorber material comprises gallium, and the fourth absorber materialcomprises one or more of sulfur and selenium, and wherein the apparatusis configured to form a chalcogenide absorber layer on the substrate.

A more complete understanding of the present invention, as well asfurther features and advantages of the present invention, will beobtained by reference to the following detailed description anddrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram illustrating an exemplary methodology forfabrication of thin film solar cells according to an embodiment of thepresent invention;

FIG. 2 is a diagram illustrating another exemplary methodology forfabrication of thin film solar cells according to an embodiment of thepresent invention;

FIGS. 3A-B are diagrams illustrating a continuous line processingapparatus for fabricating thin film solar cells according to the methodof FIG. 1 according to an embodiment of the present invention;

FIGS. 4A-B are diagrams illustrating another continuous line processingapparatus for fabricating thin film solar cells according to the methodof FIG. 1 according to an embodiment of the present invention;

FIGS. 5A-B are diagrams illustrating a continuous line processingapparatus for fabricating thin film solar cells according to the methodof FIG. 2 according to an embodiment of the present invention;

FIG. 6 is an exemplary drive system that may be employed with any of thecontinuous-line apparatuses presented herein according to an embodimentof the present invention;

FIG. 7 is a diagram illustrating an alternate embodiment whereinmaterial is deposited onto the rollers using, e.g., a sputteringprocess, and then transferred to the substrate according to anembodiment of the present invention; and

FIG. 8 is a diagram illustrating another alternate embodiment whereinmaterial is deposited directly onto the substrate using, e.g., asputtering process, and the rollers are used to apply pressure and/orheat according to an embodiment of the present invention.

DETAILED DESCRIPTION

As provided above, the fabrication ofcopper-indium-gallium-sulfur/selenium (CIGS) absorbers for thin filmsolar cell production can be accomplished by successive deposition ofelemental layers of the copper (Cu), indium (In), gallium (Ga) andsulfur (S), followed by an anneal in a selenium (Se) environment.However due to the differences in material composition, adhesionproblems can occur during the fabrication process as the layers areheated and cooled. Advantageously, provided herein are techniques forfabricating chalcogenide (e.g., CIGS) thin film solar cells that employa pressure transfer process, for example by way of rollers that applypressure to both sides of the solar cell workpiece, to control volumeexpansion and stresses on the CIGS layers that occur during thefabrication process and thereby prevent loss of adhesion between thelayers.

In one exemplary embodiment which will be described in detail below, thepresent techniques are applied to a continuous line chalcogenide (e.g.,CIGS) thin film solar cell fabrication process wherein the elementallayers of the CIGS absorber are successively applied to a substrate(e.g., molybdenum (Mo)-coated glass or metal substrate) material that isbeing continuously fed through the production line. The thin film layersof the absorber are applied at different stages of the continuous lineprocess. In some exemplary embodiments, described below, sets of rollersare employed throughout the fabrication stages to deposit the CIGSlayers onto the workpiece and/or heat/cool the workpiece while at thesame time applying pressure to both sides of the workpiece. Applyingpressure to both sides of the workpiece during the thin film fabricationprocess serves to passivate the stresses caused by the volume expansionof the layers. Thus, the above-described adhesion problems commonlyassociated with conventional thin film solar cell fabrication can beavoided.

According to the present techniques, deposition of the CIGS layers ontothe workpiece can be carried out in several different ways. For example,in one scenario an electrodeposition process is used to deposit the CIGSlayers using separate electroplating cells. As will be described indetail below, the rollers can be used during this electrodepositionprocess to simultaneously apply pressure to both sides of the workpiecewhile serving to deposit the CIGS material onto the workpiece (and atsome stages of the process heat or cool the workpiece). In anotherexemplary scenario, one or more of the CIGS components are depositedonto the workpiece from a molten bath. Again, the rollers can be usedduring this molten deposition process to simultaneously apply pressureto both sides of the workpiece while serving to deposit the CIGSmaterial onto the workpiece (and at some stages of the process heat orcool the workpiece).

An overview of the first exemplary scenario wherein the CIGS materialsare deposited onto the workpiece via electrodeposition is provided byway of reference to FIG. 1. Then an overview of the exemplary scenariowherein one or more of the CIGS materials are deposited from a moltenbath is provided by way of reference to FIG. 2. Exemplary continuousline thin film production apparatuses which may be employed to implementthe present techniques will then be shown and described by way ofreference to FIGS. 3-5.

FIG. 1 is a diagram illustrating an exemplary methodology 100 forfabrication of CIGS thin film solar cells employing electrodeposition.While the present techniques are being described in the context offabricating a solar cell, in theory the same techniques may be appliedin any continuous line thin film fabrication process. In step 102, asubstrate material is provided. Suitable substrate materials for solarcell applications include, but are not limited to, glass substrateshaving a back contact layer formed thereon such as a molybdenum(Mo)-coated glass substrate, and a flexible metal substrate, such as astainless steel foil substrate. In the exemplary embodiments describedbelow, the substrate material is fed continuously from a roll, the CIGSabsorber material is formed on the substrate material, and the output isspooled onto a second roll. This process is also referred to herein as aroll-to-roll process.

Next, in step 104 a Cu layer is deposited onto the substrate material.It is notable that in the case of a Mo-coated glass substrate, in thisstep the Cu is deposited onto the Mo layer. In order to control volumeexpansion and stresses on the layers of the cell, pressure is applied toboth sides (i.e., to a top and bottom-to the substrate and Cu layer,respectively) of the workpiece during this Cu deposition step. By way ofexample only, a linear pressure applied to the workpiece during thisstep is from about 10 N/mm to about 700 N/mm.

As will be described in detail below, in some exemplary embodiments, theCu deposition and simultaneous application of pressure to the workpieceis performed via a set of two rollers that are in contact with opposingsides (i.e., one roller is in contact with the top and one roller is incontact with the bottom) of the workpiece such that as the workpiece isfed through the continuous line fabrication process, the workpiecepasses between the set of rollers.

According to an exemplary embodiment, the rollers are configured todeposit the Cu onto the workpiece from a Cu-containing electrochemicalelectrolyte solution through which one of the rollers passes. Namely,the Cu (which is electrodeposited onto the roller from the electrolytesolution) is transferred from the roller onto the workpiece. Thetransfer of the Cu from the roller to the workpiece can be facilitatedby cooling the roller, see below. Namely, as will be described in detailbelow, the rollers may be made of a metal such as stainless steel. Thematerial (in this case Cu) will be deposited via the rollers onto thesubstrate under pressure—as provided above. Cooling the rollers willfacilitate cladding the Cu to the workpiece, rather than to the (metal)roller. Further, due to this being a continuous line process, as theworkpiece passes through each stage, the material already deposited andcladded onto the workpiece will aid in removing the material from theroller (similar to when any sort of material is unwound from a roll) andcooling the rollers facilitates removal of the material from the roll.Thus, in one exemplary embodiment, the rollers are in this step cooledto a temperature of from about −5° C. to about 10° C. Thus, in thisexemplary embodiment, the rollers are configured to simultaneously 1)apply Cu to the workpiece and 2) apply pressure to both sides of theworkpiece. Pressure is defined herein as a physical force being exertedon a first object (in this case the workpiece) by one or more otherobjects (in this case the rollers) in contact with the first object. Asthe CIGS absorber layers are successively deposited onto the substrate,pressure is applied to the workpiece via the rollers which are incontact with the substrate and the layer currently being deposited.Thus, during the Cu deposition step, pressure from the rollers isexerted simultaneously on the Cu layer and on the substrate. During theIn deposition step, pressure from the rollers is exerted simultaneouslyon the In layer and on the substrate. And so on.

As will be described in detail below, electrodeposition is only onepossible process that may be implemented to deposit the thin filmmaterials onto the substrate. For instance, the Cu can be deposited ontothe rollers using for example a sputtering (or other suitable process)and then transferred from the rollers to the substrate in the mannerdescribed above. Alternatively, the Cu can be deposited directly ontothe substrate and pressure/heat would be applied via the rollers in themanner described above. These alternative embodiments are described indetail below.

In order to bond the Cu deposited onto the substrate material in step104, pressure and heat are applied to the workpiece in step 106. Thisprocess of bonding dissimilar metals (e.g., the Cu with the metalsubstrate or with the Mo-coated substrate) is also referred to herein bythe term “cladding.” Linear pressure (e.g., from about 10 N/mm to about700 N/mm) is applied to both sides (i.e., to a top and bottom-to the Culayer and substrate, respectively) of the workpiece during this stepwhich, as provided above, also serves to control volume expansion andstresses on the layers of the cell. By way of example only, theworkpiece may be heated at this step to a temperature of from about 50°C. to about 250° C.

As will be described in detail below, in some exemplary embodiments, theheating and simultaneous application of pressure to the workpiece isperformed in step 106 via a set of two rollers that are in contact withopposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be heatedto thereby heat the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) heatthe workpiece and 2) apply pressure to both sides of the workpiece.

Next, in step 108 an In layer is deposited onto the substrate materialon top of the Cu layer. In order to control volume expansion andstresses on the layers of the cell, pressure is applied to both sides(i.e., to a top and bottom-to the substrate and In layer, respectively)of the workpiece during this In deposition step. Exemplary pressurevalues that may be employed during this metal deposition step wereprovided above.

As will be described in detail below, in some exemplary embodiments, theIn deposition and simultaneous application of pressure to the workpieceis performed via another set of rollers that are in contact withopposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can beconfigured to deposit the In onto the workpiece from a In-containingelectrochemical electrolyte solution through which one of the rollerspasses. Namely, the In (which is electrodeposited onto the roller fromthe electrolyte solution) is transferred from the roller onto theworkpiece. As with the case of the Cu deposition above, the transfer ofthe In from the roller to the workpiece can be facilitated by coolingthe roller, see below. Exemplary temperature values were provided aboveregarding cooling the workpiece to facilitate material transfer from therollers to the workpiece. Thus, in this exemplary embodiment, therollers are configured to simultaneously 1) apply In to the workpiece,and 2) apply pressure to both sides of the workpiece.

Cladding of the In deposited onto the Cu layer (in step 108) is achievedby applying pressure and heat to the workpiece in step 110. Exemplarytemperature and pressure values for this cladding process were providedabove.

Alternatively, as provided above, electrodeposition is only oneexemplary process that may be employed herein for depositing thematerial onto the substrate. For instance, another suitable depositionprocess (such as sputtering) may be used to deposit the material ontothe rollers, which then apply the material to the substrate in themanner described above. Alternatively, the material may be depositeddirectly onto the substrate with pressure and/or heat being supplied viathe rollers as described above. These alternative embodiments aredescribed in detail below.

As will be described in detail below, in some exemplary embodiments, theheating and simultaneous application of pressure to the workpiece isperformed in step 110 via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be heatedto thereby heat the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) heatthe workpiece and 2) apply pressure to both sides of the workpiece.

Next, in step 112 a Ga layer is deposited onto the substrate material ontop of the In layer. In order to control volume expansion and stresseson the layers of the cell, pressure is applied to both sides (i.e., to atop and bottom-to the substrate and Ga layer, respectively) of theworkpiece during this Ga deposition step. Exemplary pressure values thatmay be employed during this metal deposition step were provided above.

As will be described in detail below, in some exemplary embodiments, theGa deposition and simultaneous application of pressure to the workpieceis performed via another set of rollers that are in contact withopposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can beconfigured to deposit the Ga onto the workpiece from a Ga-containingelectrochemical electrolyte solution through which one of the rollerspasses. Namely, the Ga (which is electrodeposited onto the roller fromthe electrolyte solution) is transferred from the roller onto theworkpiece. As with the materials above, the transfer of the Ga from theroller to the workpiece can be facilitated by cooling the roller, seebelow. Thus, in one exemplary embodiment, the rollers are in this stepare cooled. Exemplary temperature values were provided above regardingcooling the workpiece to facilitate material transfer from the rollersto the workpiece. Thus, in this exemplary embodiment, the rollers areconfigured to simultaneously 1) apply Ga to the workpiece, and 2) applypressure to both sides of the workpiece.

Cladding of the Ga deposited onto the In layer (in step 112) is achievedby applying pressure and heat to the workpiece in step 114. Exemplarytemperature and pressure values for this cladding process were providedabove.

Alternatively, as provided above, electrodeposition is only oneexemplary process that may be employed herein for depositing thematerial onto the substrate. For instance, another suitable depositionprocess (such as sputtering) may be used to deposit the material ontothe rollers, which then apply the material to the substrate in themanner described above. Alternatively, the material may be depositeddirectly onto the substrate with pressure and/or heat being supplied viathe rollers as described above. These alternative embodiments aredescribed in detail below.

As will be described in detail below, in some exemplary embodiments, theheating and simultaneous application of pressure to the workpiece isperformed in step 114 via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be heatedto thereby heat the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) heatthe workpiece and 2) apply pressure to both sides of the workpiece.

In step 116, the workpiece is subjected to an intermediate or softanneal. As with the heating steps described above, pressure is appliedto the workpiece while the workpiece is heated during step 116. Whilethe soft anneal performed in step 116 is optional, uniformity of thefinal CIGS material will be enhanced by performing thissoft/intermediate anneal. According to an exemplary embodiment, in step116 the workpiece is annealed at a temperature of from about 100° C. toabout 300° C., e.g., at a temperature of about 155° C., while a linearpressure of from about 10 N/mm to about 700 N/mm is simultaneouslyapplied to both sides (i.e., to a top and bottom) of the workpiecewhich, as provided above, also serves to control volume expansion andstresses on the layers of the cell. As will be described below, a finalanneal will be performed in an S-containing environment to complete theCIGS absorber.

As will be described in detail below, in some exemplary embodiments, theheating and simultaneous application of pressure to the workpiece isperformed in step 116 via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be heatedto thereby heat the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) heatthe workpiece and 2) apply pressure to both sides of the workpiece.

Next, in step 118 a S, Se, or S+Se layer (abbreviated herein as S/Selayer) is deposited onto the substrate material on top of the Ga layer.In order to control volume expansion and stresses on the layers of thecell, pressure is applied to both sides (i.e., to a top and bottom-tothe substrate and S/Se layer, respectively) of the workpiece during thisS/Se deposition step. Exemplary pressure values that may be employedduring this metal deposition step were provided above.

As will be described in detail below, in some exemplary embodiments, theS/Se deposition and simultaneous application of pressure to theworkpiece is performed via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can beconfigured to deposit the S/Se onto the workpiece from a S/Se-containingelectrochemical electrolyte solution through which one of the rollerspasses. Namely, the S/Se (which is electrodeposited onto the roller fromthe electrolyte solution) is transferred from the roller onto theworkpiece. As with the materials above, the transfer of the S/Se fromthe roller to the workpiece can be facilitated by cooling the roller,see below. Thus, in one exemplary embodiment, the rollers are in thisstep cooled. Exemplary temperature values were provided above regardingcooling the workpiece to facilitate material transfer from the rollersto the workpiece. Thus, in this exemplary embodiment, the rollers areconfigured to simultaneously 1) apply S/Se to the workpiece, and 2)apply pressure to both sides of the workpiece.

Cladding of the S/Se deposited onto the Ga layer (in step 118) isachieved by applying pressure and heat to the workpiece in step 120.Exemplary temperature and pressure values for this cladding process wereprovided above.

As provided above, electrodeposition is only one exemplary process thatmay be employed herein for depositing the material onto the substrate.For instance, another suitable deposition process (such as sputtering)may be used to deposit the material onto the rollers, which then applythe material to the substrate in the manner described above.Alternatively, the material may be deposited directly onto the substratewith pressure and/or heat being supplied via the rollers as describedabove. These alternative embodiments are described in detail below.

As will be described in detail below, in some exemplary embodiments, theheating and simultaneous application of pressure to the workpiece isperformed in step 120 via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be heatedto thereby heat the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) heatthe workpiece and 2) apply pressure to both sides of the workpiece.

Finally, in step 122, the workpiece is subjected to a final anneal in aS environment. As with the heating steps described above, pressure isapplied to the workpiece while the workpiece is heated during step 122.According to an exemplary embodiment, in step 122 the workpiece isannealed at a temperature of from about 500° C. to about 600° C., e.g.,at a temperature of about 500° C., while a linear pressure of from about10 N/mm to about 700 N/mm is simultaneously applied to both sides (i.e.,to a top and bottom) of the workpiece which, as provided above, alsoserves to control volume expansion and stresses on the layers of thecell.

As will be described in detail below, in some exemplary embodiments, theheating and simultaneous application of pressure to the workpiece isperformed in step 122 via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be heatedto thereby heat the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) heatthe workpiece and 2) apply pressure to both sides of the workpiece.

The CIGS absorber is now complete. Any further processing of the cellcan be carried out using conventional techniques to form a buffer layer,top electrode, etc. to complete the solar cell.

It is notable that the thin film compositions described above, andelsewhere herein are merely examples intended to illustrate the presenttechniques, and a variety of other film compositions can be achieved inthe manner described herein. One would need only to vary the compositionof the materials deposited in one or more of the steps and/or the orderin which the materials are deposited in order to achieve different thinfilm compositions. In addition to the CIGS example provided above, byway of example only, one may adapt the present techniques to produce anyof the following thin film solar cell compositions: CZTS(Cu₂ZnSn(Se,S)₄), FeS₂, Zn₂P₃, CdSe, CdS, ZnSe, WSe₂, MoSe₂, Bi₂S₃,Ag₂S, Cu₂Zn(Fe,Sn)(Se,S)₄, CuxS, CdTe, ZnTe, PbSe, PdS, NiS, NiSeS, InP,ZnO, GaAs. An example involving a I-III-IV₂ material is provided below.

As provided above, according to another exemplary scenario, one or moreof the CIGS components are deposited onto the workpiece from a moltenbath. An overview of this process is now provided by way of reference toFIG. 2. FIG. 2 is a diagram illustrating an exemplary methodology 200for fabrication of CIGS thin film solar cells wherein one or more of theCIGS materials are deposited from a molten bath. While the presenttechniques are being described in the context of fabricating a solarcell, in theory the same techniques may be applied in any continuousline thin film fabrication process.

In step 202, a substrate material is provided. Suitable substratematerials for solar cell applications include, but are not limited to,glass substrates having a back contact layer formed thereon such as aMo-coated glass substrate, and a flexible metal substrate, such as astainless steel foil substrate. In the exemplary embodiments describedbelow, the substrate material is fed continuously from a roll, the CIGSabsorber material is formed on the substrate material, and the output isspooled onto a second roll. This process is also referred to herein as aroll-to-roll process.

Next, in step 204 a Cu layer is deposited onto the substrate material.It is notable that in the case of a Mo-coated glass substrate, in thisstep the Cu is deposited onto the Mo layer. In order to control volumeexpansion and stresses on the layers of the cell, pressure is applied toboth sides (i.e., to a top and bottom-to the substrate and Cu layer,respectively) of the workpiece during this Cu deposition step. By way ofexample only, a linear pressure applied to the workpiece during thisstep is from about 10 N/mm to about 700 N/mm. In this example, the Cuwill be deposited in step 204 by electrodeposition from an electrolyte,whereas the In, Ga and S will be deposited from a molten bath.

As will be described in detail below, in some exemplary embodiments, theCu deposition and simultaneous application of pressure to the workpieceis performed via a set of two rollers that are in contact with opposingsides (i.e., one roller is in contact with the top and one roller is incontact with the bottom) of the workpiece such that as the workpiece isfed through the continuous line fabrication process, the workpiecepasses between the set of rollers. The rollers can be configured todeposit the Cu onto the workpiece from a Cu-containing electrolytesolution through which one of the rollers passes. Namely, the Cu (whichis electrodeposited onto the roller from the electrochemical electrolytesolution) is transferred from the roller onto the workpiece. Asdescribed above, the transfer of the Cu from the roller to the workpiececan be facilitated by cooling the roller. Exemplary temperature valuesfor cooling the rollers to facilitate material transfer from the rollerto the workpiece were provided above. Thus, in this exemplaryembodiment, the rollers are configured to simultaneously 1) apply Cu tothe workpiece, and 2) apply pressure to both sides of the workpiece.

As provided above, electrodeposition is only one exemplary process thatmay be employed herein for depositing the material onto the substrate.For instance, another suitable deposition process (such as sputtering)may be used to deposit the material onto the rollers, which then applythe material to the substrate in the manner described above.Alternatively, the material may be deposited directly onto the substratewith pressure and/or heat being supplied via the rollers as describedabove. These alternative embodiments are described in detail below.

In order to bond the Cu deposited onto the substrate material in step204, pressure and heat are applied to the workpiece in step 206. Thisprocess of bonding dissimilar metals (e.g., the Cu with the metalsubstrate or with the Mo-coated substrate) is also referred to herein bythe term “cladding.” Linear pressure (e.g., from about 10 N/mm to about700 N/mm) is applied to both sides (i.e., to a top and bottom) of theworkpiece during this step which, as provided above, also serves tocontrol volume expansion and stresses on the layers of the cell. By wayof example only, the workpiece may be heated at this step to atemperature of from about 50° C. to about 250° C.

As will be described in detail below, in some exemplary embodiments, theheating and simultaneous application of pressure to the workpiece isperformed in step 206 via a set of two rollers that are in contact withopposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be heatedto thereby heat the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) heatthe workpiece and 2) apply pressure to both sides of the workpiece.

Next, in step 208 an In layer is deposited onto the substrate materialon top of the Cu layer. In order to control volume expansion andstresses on the layers of the cell, pressure is applied to both sides(i.e., to a top and bottom-to the substrate and In layer, respectively)of the workpiece during this In deposition step. Exemplary pressurevalues that may be employed during this metal deposition step wereprovided above.

As will be described in detail below, in some exemplary embodiments, theIn deposition and simultaneous application of pressure to the workpieceis performed via another set of rollers that are in contact withopposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can beconfigured to deposit the In onto the workpiece from a bath of molten Inthrough which one of the rollers passes. Namely, as the roller passesthrough the bath, some of the molten In is picked up by the roller andtransferred to the workpiece. Thus, in this exemplary embodiment, therollers are configured to simultaneously 1) apply In to the workpiece,2) apply pressure to both sides of the workpiece.

The In material deposited in step 208 will still be (at least to someextent) molten after it is transferred to the workpiece. Thus, in step210 the workpiece is cooled. In order to control volume expansion andstresses on the layers of the cell, pressure is applied to both sides(i.e., to a top and bottom) of the workpiece during this cooling step.By way of example only, the workpiece is cooled in this step to atemperature of from about −5° C. to about 10° C. and the linear pressureapplied to the workpiece during this step is from about 10 N/mm to about700 N/mm.

As will be described in detail below, m some exemplary embodiments, thecooling and simultaneous application of pressure to the workpiece isperformed in step 210 via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be cooledto thereby cool the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) coolthe workpiece and 2) apply pressure to both sides of the workpiece.

Next, in step 212 a Ga layer is deposited onto the substrate material ontop of the In layer. In order to control volume expansion and stresseson the layers of the cell, pressure is applied to both sides (i.e., to atop and bottom-to the substrate and Ga layer, respectively) of theworkpiece during this Ga deposition step. Exemplary pressure values thatmay be employed during this metal deposition step were provided above.

As will be described in detail below, in some exemplary embodiments, theGa deposition and simultaneous application of pressure to the workpieceis performed via another set of rollers that are in contact withopposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can beconfigured to deposit the Ga onto the workpiece from a bath of molten Gathrough which one of the rollers passes. Namely, as the roller passesthrough the bath, some of the molten Ga is picked up by the roller andtransferred to the workpiece. Thus, in this exemplary embodiment, therollers are configured to simultaneously 1) apply Ga to the workpiece,2) apply pressure to both sides of the workpiece.

The Ga material deposited in step 212 will still be (at least to someextent) molten after it is transferred to the workpiece. Thus, in step214 the workpiece is cooled. In order to control volume expansion andstresses on the layers of the cell, pressure is applied to both sides(i.e., to a top and bottom) of the workpiece during this cooling step.Exemplary temperature and pressure values for this stage of the processwere provided above.

As will be described m detail below, in some exemplary embodiments, thecooling and simultaneous application of pressure to the workpiece isperformed in step 212 via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be cooledto thereby cool the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) coolthe workpiece and 2) apply pressure to both sides of the workpiece.

In step 216, the workpiece is subjected to an intermediate or softanneal. As with the heating steps described above, pressure is appliedto the workpiece while the workpiece is heated during step 216. Whilethe soft anneal performed in step 216 is optional, uniformity of thefinal CIGS material will be enhanced by performing thissoft/intermediate anneal. According to an exemplary embodiment, in step216 the workpiece is annealed at a temperature of from about 100° C. toabout 300° C., e.g., at a temperature of about 155° C., while a linearpressure of from about 10 N/mm to about 700 N/mm is simultaneouslyapplied to both sides (i.e., to a top and bottom) of the workpiecewhich, as provided above, also serves to control volume expansion andstresses on the layers of the cell. As will be described below, a finalanneal will be performed in an S-containing environment to complete theCIGS absorber.

As will be described in detail below, in some exemplary embodiments, theheating and simultaneous application of pressure to the workpiece isperformed in step 216 via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be heatedto thereby heat the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) heatthe workpiece and 2) apply pressure to both sides of the workpiece.

Next, in step 218 a S/Se layer is deposited onto the substrate materialon top of the Ga layer. In order to control volume expansion andstresses on the layers of the cell, pressure is applied to both sides(i.e., to a top and bottom-to the substrate and S/Se layer,respectively) of the workpiece during this S/Se deposition step.Exemplary pressure values that may be employed during this metaldeposition step were provided above.

As will be described in detail below, in some exemplary embodiments, theS/Se deposition and simultaneous application of pressure to theworkpiece is performed via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can beconfigured to deposit the S/Se onto the workpiece from a bath of moltenS/Se through which one of the rollers passes. Namely, as the rollerpasses through the bath, some of the molten S/Se is picked up by theroller and transferred to the workpiece. Thus, in this exemplaryembodiment, the rollers are configured to simultaneously 1) apply S/Seto the workpiece, 2) apply pressure to both sides of the workpiece.

The S/Se material deposited in step 218 will still be (at least to someextent) molten after it is transferred to the workpiece. Thus, in step220 the workpiece is cooled. In order to control volume expansion andstresses on the layers of the cell, pressure is applied to both sides(i.e., to a top and bottom) of the workpiece during this cooling step.Exemplary temperature and pressure values for this stage of the processwere provided above.

As will be described in detail below, in some exemplary embodiments, thecooling and simultaneous application of pressure to the workpiece isperformed in step 220 via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be cooledto thereby cool the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) coolthe workpiece and 2) apply pressure to both sides of the workpiece.

Finally, in step 222, the workpiece is subjected to a final anneal in aS environment. As with the heating steps described above, pressure isapplied to the workpiece while the workpiece is heated during step 222.According to an exemplary embodiment, in step 222 the workpiece isannealed at a temperature of from about 500° C. to about 600° C., e.g.,at a temperature of about 500° C., while a linear pressure of from about10 N/mm to about 700 N/mm is simultaneously applied to both sides (i.e.,to a top and bottom) of the workpiece which, as provided above, alsoserves to control volume expansion and stresses on the layers of thecell.

As will be described in detail below, in some exemplary embodiments, theheating and simultaneous application of pressure to the workpiece isperformed in step 222 via another set of rollers that are in contactwith opposing sides (i.e., one roller is in contact with the top and oneroller is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the set of rollers. The rollers can be heatedto thereby heat the workpiece as the workpiece passes between therollers. Thus, in this exemplary embodiment, the rollers at this stageof the continuous line process are configured to simultaneously 1) heatthe workpiece and 2) apply pressure to both sides of the workpiece.

The CIGS absorber is now complete. Any further processing of the cellcan be carried out using conventional techniques to form a buffer layer,top electrode, etc. to complete the solar cell.

It is notable that the above sequence of processing steps is merelyexemplary, and depending on the desired final composition of the thinfilm solar cell the sequence of steps performed and/or the materialsdeposited at each of the stages may vary. Thus, the present process isconfigurable to a variety of different thin film configurations. What isnotable here is that the present techniques provide means to applypressure to both sides of the workpiece while simultaneously depositinga thin film material (and potentially also simultaneously heating orcooling the workpiece). The exact thin film material being depositedand/or the order in which the materials are deposited, heated/cooled,etc. can be varied yet still remain within the confines of the presenttechniques.

Further, as is apparent from the description above, in accordance withthe present techniques, the materials may be deposited from anelectrochemical solution (via an electrodeposition process) and/or fromanother chemical solution (e.g., via deposition from a molten bath,sputtering, etc.). The term “electrochemical solution” as used hereinwill generally refer to the solutions described herein for use in anelectrodeposition process. All other solutions used for depositing thepresent materials onto the substrate (e.g., molten metal bath) willgenerally be referred to herein as “chemical solutions.”

Exemplary embodiments implementing the present techniques forcontinuous-line fabrication of thin film solar cells are now describedby way of reference to FIGS. 3-5. In FIGS. 3A-B a continuous lineprocessing apparatus is depicted performing the method described in FIG.1, above (i.e., wherein deposition of the various CIGS layers occurs viaelectrodeposition) on a Mo-coated glass substrate. It is to beunderstood that FIGS. 3A-B illustrate a single, continuous-lineapparatus/process, however, for ease and clarity of depiction, thefigure is broken into two parts (FIG. 3A and FIG. 3B).

As shown in FIG. 3A, a Mo-coated glass substrate is fed into theapparatus between a first set of rollers 302. As described inconjunction with the description of step 104 of FIG. 1, above, a Culayer is deposited onto the substrate (i.e., onto the Mo layer of theMo-coated substrate) while at the same time pressure is applied to bothsides (i.e., to a top and bottom) of the workpiece in order to controlvolume expansion and stresses on the layers of the cell. In theembodiment shown in FIG. 3A, this Cu deposition and simultaneousapplication of pressure to the workpiece is performed via rollers 302which as shown in FIG. 3A are in contact with opposing sides (i.e., oneof rollers 302 is in contact with the top and one of rollers 302 is incontact with the bottom) of the workpiece such that as the workpiece isfed through the continuous line fabrication process, the workpiecepasses between rollers 302. Further, as shown in FIG. 3A, the rollers302 are configured to deposit the Cu onto the workpiece from aCu-containing electrolyte solution through which one of the rollers 302passes. Namely, according to an exemplary embodiment, rollers 302 aremade of a metal such as stainless steel. As the bottom roller 302 passesthrough the Cu-containing electrolyte solution, the Cu iselectrodeposited onto the roller from the electrolyte solution. In thisexample, there is an anode in the electrolyte solution and the bottom(e.g., metal) roller 302 acts as a cathode for the electrodepositionprocess. The Cu electrodeposited on the bottom roller 302 is thentransferred (from the bottom roller 302) onto the workpiece. Asdescribed above, the transfer of the Cu from the bottom roller 302 tothe workpiece can be facilitated by cooling the rollers 302. Namely,cooling the rollers will facilitate cladding the Cu to the workpiece,rather than to the (metal) roller itself. Further, due to this being acontinuous line process, as the workpiece passes through each stage, thematerial already deposited and cladded onto the workpiece will aid inremoving the material from the roller (similar to when any sort ofmaterial is unwound from a roll) and cooling the rollers facilitatesremoval of the material from the roll. Temperature and pressureparameters for this step were provided above. Thus, in this exemplaryembodiment, the rollers 302 are configured to simultaneously 1) apply Cuto the workpiece and 2) apply pressure to both sides of the workpiece.

The pressure applied to the workpiece by the rollers 302 may be based onthe weight of the top roller 302 pressing down on the workpiece againstthe bottom roller 302. Thus, as shown in FIG. 3A, the top roller 302might have a size (wherein the size of a roller is determined based onits cross-sectional diameter) that equates with a certain weight of thetop roller 302 to achieve a desired amount of pressure when the weightof the top roller 302 is applied to the workpiece against the bottomroller 302. Accordingly the top roller 302 and the bottom roller 302 arenot shown to be the same size as one another.

As shown in FIG. 3A, a (e.g., nitrogen (N₂)) air knife present in thedirection of rotation between the plating cell and the workpiece servesto direct plating solution from the roller 302 back into the Cu platingcell. A water jet may also be implemented in the line following the Cudeposition, to clean the workpiece, followed by an air drying step toremove the water.

As described in conjunction with the description of step 106 of FIG. 1,above, in order to bond the Cu deposited onto the substrate material,pressure and heat are applied to the workpiece in step 106. The pressureserves to control volume expansion and stresses on the layers of thecell. In the exemplary embodiments shown in FIG. 3A, this heating andsimultaneous application of pressure to the workpiece is performed viarollers 304 that are in contact with opposing sides (i.e., one of therollers 304 is in contact with the top and one of the rollers 304 is incontact with the bottom) of the workpiece such that as the workpiece isfed through the continuous line fabrication process, the workpiecepasses between the rollers 304. The rollers 304 can be heated to therebyheat the workpiece as the workpiece passes between the rollers 304.Temperature and pressure parameters for this step were provided above.Thus, in this exemplary embodiment, the rollers 304 at this stage of thecontinuous line process are configured to simultaneously 1) heat theworkpiece and 2) apply pressure to both sides of the workpiece.

As provided above, electrodeposition is only one exemplary process thatmay be employed herein for depositing the material onto the substrate.For instance, another suitable deposition process (such as sputtering)may be used to deposit the material onto the rollers, which then applythe material to the substrate in the manner described above.Alternatively, the material may be deposited directly onto the substratewith pressure and/or heat being supplied via the rollers as describedabove. These alternative embodiments are described in detail below.

As described in conjunction with the description of step 108 of FIG. 1,above, a In layer is deposited onto the substrate on top of the Cu layerwhile at the same time pressure is applied to both sides (i.e., to a topand bottom) of the workpiece in order to control volume expansion andstresses on the layers of the cell. In the embodiment shown in FIG. 3A,this In deposition and simultaneous application of pressure to theworkpiece is performed via rollers 306 which as shown in FIG. 3A are incontact with opposing sides (i.e., one of rollers 306 is in contact withthe top and one of rollers 306 is in contact with the bottom) of theworkpiece such that as the workpiece is fed through the continuous linefabrication process, the workpiece passes between rollers 306. Further,as shown in FIG. 3A, the rollers 306 are configured to deposit the Inonto the workpiece from an In-containing electrolyte solution throughwhich one of the rollers 306 passes. Namely, as described above, therollers 302 can be made of a metal such as stainless steel and as thebottom roller 306 passes through the In-containing electrolyte solution,the In is electrodeposited onto the roller from the electrolyte solution(i.e., the bottom roller 306 acts as a cathode for the electrodepositionprocess). The In electrodeposited on the bottom roller 306 is thentransferred (from the bottom roller 306) onto the workpiece. Asdescribed above, the transfer of the In from the bottom roller 306 tothe workpiece can be facilitated by cooling the rollers 306—to insurecladding of the In onto the workpiece rather than onto the rollers.Temperature and pressure parameters for this step were provided above.Thus, in this exemplary embodiment, the rollers 306 are configured tosimultaneously 1) apply In to the workpiece and 2) apply pressure toboth sides of the workpiece.

As described above, the pressure applied to the workpiece by the rollers306 may be based on the weight of the top roller 306 pressing down onthe workpiece against the bottom roller 306. Accordingly, as providedabove, the rollers 306 may not be the same size as one another.

While not explicitly shown in FIG. 3A, a (e.g., nitrogen (N₂)) air knifemay be present in the direction of rotation between the plating cell andthe workpiece to direct plating solution from the rollers 306 back intothe In plating cell. A water jet may also be implemented in the linefollowing the In deposition, to clean the workpiece, followed by an airdrying step to remove the water. The air knife, water jet and air dryingwould be implemented in the same manner as described above inconjunction with the Cu deposition electroplating stage.

As described in conjunction with the description of step 110 of FIG. 1,above, in order to bond the In deposited onto the substrate material,pressure and heat are applied to the workpiece. The pressure serves tocontrol volume expansion and stresses on the layers of the cell. In theexemplary embodiments shown in FIG. 3A, this heating and simultaneousapplication of pressure to the workpiece is performed via rollers 308that are in contact with opposing sides (i.e., one of the rollers 308 isin contact with the top and one of the rollers 308 is in contact withthe bottom) of the workpiece such that as the workpiece is fed throughthe continuous line fabrication process, the workpiece passes betweenthe rollers 308. The rollers 308 can be heated to thereby heat theworkpiece as the workpiece passes between the rollers 308. Temperatureand pressure parameters for this step were provided above. Thus, in thisexemplary embodiment, the rollers 308 at this stage of the continuousline process are configured to simultaneously 1) heat the workpiece and2) apply pressure to both sides of the workpiece.

Again, electrodeposition is only one exemplary process that may beemployed herein for depositing the material onto the substrate. Forinstance, another suitable deposition process (such as sputtering) maybe used to deposit the material onto the rollers, which then apply thematerial to the substrate in the manner described above. Alternatively,the material may be deposited directly onto the substrate with pressureand/or heat being supplied via the rollers as described above.

As described in conjunction with the description of step 112 of FIG. 1,above, a Ga layer is deposited onto the substrate on top of the In layerwhile at the same time pressure is applied to both sides (i.e., to a topand bottom) of the workpiece in order to control volume expansion andstresses on the layers of the cell. In the embodiment shown in FIG. 3A,this Ga deposition and simultaneous application of pressure to theworkpiece is performed via rollers 310 which as shown in FIG. 3A are incontact with opposing sides (i.e., one of rollers 310 is in contact withthe top and one of rollers 310 is in contact with the bottom) of theworkpiece such that as the workpiece is fed through the continuous linefabrication process, the workpiece passes between rollers 310. Further,as shown in FIG. 3A, the rollers 310 are configured to deposit the Gaonto the workpiece from a Ga-containing electrolyte solution throughwhich one of the rollers 310 passes. Namely, as described above, therollers 310 can be made of a metal such as stainless steel and as thebottom roller 310 passes through the Ga-containing electrolyte solution,the Ga is electrodeposited onto the roller from the electrolyte solution(i.e., the bottom roller 310 acts as a cathode for the electrodepositionprocess). The Ga electrodeposited on the bottom roller 310 is thentransferred (from the bottom roller 310) onto the workpiece. Asdescribed above, the transfer of the Ga from the bottom roller 310 tothe workpiece can be facilitated by cooling the rollers 310—to insurecladding of the Ga onto the workpiece rather than onto the rollers.Temperature and pressure parameters for this step were provided above.Thus, in this exemplary embodiment, the rollers 310 are configured tosimultaneously 1) apply Ga to the workpiece and 2) apply pressure toboth sides of the workpiece.

As described above, the pressure applied to the workpiece by the rollers310 may be based on the weight of the top roller 310 pressing down onthe workpiece against the bottom roller 310. Accordingly, as providedabove, the rollers 310 may not be the same size as one another.

While not explicitly shown in FIG. 3A, a (e.g., nitrogen (N₂)) air knifemay be present in the direction of rotation between the plating cell andthe workpiece to direct plating solution from the rollers 310 back intothe Ga plating cell. A water jet may also be implemented in the linefollowing the Ga deposition, to clean the workpiece, followed by an airdrying step to remove the water. The air knife, water jet and air dryingwould be implemented in the same manner as described above inconjunction with the Cu deposition electroplating stage.

As described in conjunction with the description of step 114 of FIG. 1,above, in order to bond the Ga deposited onto the substrate material,pressure and heat are applied to the workpiece. The pressure serves tocontrol volume expansion and stresses on the layers of the cell. In theexemplary embodiment shown in FIG. 3A, this heating and simultaneousapplication of pressure to the workpiece is performed via rollers 312that are in contact with opposing sides (i.e., one of the rollers 312 isin contact with the top and one of the rollers 312 is in contact withthe bottom) of the workpiece such that as the workpiece is fed throughthe continuous line fabrication process, the workpiece passes betweenthe rollers 312. The rollers 312 can be heated to thereby heat theworkpiece as the workpiece passes between the rollers 312. Temperatureand pressure parameters for this step were provided above. Thus, in thisexemplary embodiment, the rollers 312 at this stage of the continuousline process are configured to simultaneously 1) heat the workpiece and2) apply pressure to both sides of the workpiece.

As described in conjunction with the description of step 116 of FIG. 1,above, following deposition of the Ga onto the workpiece an optionalsoft/intermediate anneal may be performed to enhance the uniformity ofthe final CIGS material. Temperature and pressure parameters for thisstep were provided above. As with the heating steps described above,pressure is applied to the workpiece while the workpiece is heatedduring this soft annealing step. In the exemplary embodiment shown inFIG. 3B, this heating and simultaneous application of pressure to theworkpiece is performed via rollers 314 that are in contact with opposingsides (i.e., one of the rollers 314 is in contact with the top and oneof the rollers 314 is in contact with the bottom) of the workpiece suchthat as the workpiece is fed through the continuous line fabricationprocess, the workpiece passes between the rollers 314. The rollers 314can be heated to thereby heat the workpiece as the workpiece passesbetween the rollers 314. Temperature and pressure parameters for thisstep were provided above. Thus, in this exemplary embodiment, therollers 314 at this stage of the continuous line process are configuredto simultaneously 1) heat the workpiece and 2) apply pressure to bothsides of the workpiece.

Again, electrodeposition is only one exemplary process that may beemployed herein for depositing the material onto the substrate. Forinstance, another suitable deposition process (such as sputtering) maybe used to deposit the material onto the rollers, which then apply thematerial to the substrate in the manner described above. Alternatively,the material may be deposited directly onto the substrate with pressureand/or heat being supplied via the rollers as described above.

As described in conjunction with the description of step 118 of FIG. 1,above, a S and/or Se layer is deposited onto the substrate on top of theGa layer while at the same time pressure is applied to both sides (i.e.,to a top and bottom) of the workpiece in order to control volumeexpansion and stresses on the layers of the cell. In the embodimentshown in FIG. 3B, this S/Se deposition and simultaneous application ofpressure to the workpiece is performed via rollers 316 which as shown inFIG. 3B are in contact with opposing sides (i.e., one of rollers 316 isin contact with the top and one of rollers 316 is in contact with thebottom) of the workpiece such that as the workpiece is fed through thecontinuous line fabrication process, the workpiece passes betweenrollers 316. Further, as shown in FIG. 3B, the rollers 316 areconfigured to deposit the S/Se onto the workpiece from a S/Se-containingelectrolyte solution through which one of the rollers 316 passes.Namely, as described above, the rollers 316 can be made of a metal suchas stainless steel and as the bottom roller 316 passes through theS/Se-containing electrolyte solution, the S/Se is electrodeposited ontothe roller from the electrolyte solution (i.e., the bottom roller 316acts as a cathode for the electrodeposition process). The S/Seelectrodeposited on the bottom roller 316 is then transferred (from thebottom roller 316) onto the workpiece. As described above, the transferof the S/Se from the bottom roller 316 to the workpiece can befacilitated by cooling the rollers 316—to insure cladding of the S/Seonto the workpiece rather than onto the rollers. Temperature andpressure parameters for this step were provided above. Thus, in thisexemplary embodiment, the rollers 316 are configured tosimultaneously 1) apply S/Se to the workpiece and 2) apply pressure toboth sides of the workpiece. As described above, the pressure applied tothe workpiece by the rollers 316 may be based on the weight of the toproller 316 pressing down on the workpiece against the bottom roller 316.Accordingly, as provided above, the rollers 316 may not be the same sizeas one another.

While not explicitly shown in FIG. 3B, a (e.g., nitrogen (N₂)) air knifemay be present in the direction of rotation between the plating cell andthe workpiece to direct plating solution from the rollers 316 back intothe S/Se plating cell. A water jet may also be implemented in the linefollowing the S/Se deposition, to clean the workpiece, followed by anair drying step to remove the water. The air knife, water jet and airdrying would be implemented in the same manner as described above inconjunction with the Cu deposition electroplating stage.

Again, electrodeposition is only one exemplary process that may beemployed herein for depositing the material onto the substrate. Forinstance, another suitable deposition process (such as sputtering) maybe used to deposit the material onto the rollers, which then apply thematerial to the substrate in the manner described above. Alternatively,the material may be deposited directly onto the substrate with pressureand/or heat being supplied via the rollers as described above.

As described in conjunction with the description of step 120 of FIG. 1,above, in order to bond the S/Se deposited onto the substrate material,pressure and heat are applied to the workpiece. The pressure serves tocontrol volume expansion and stresses on the layers of the cell. In theexemplary embodiment shown in FIG. 3B, this heating and simultaneousapplication of pressure to the workpiece is performed via rollers 318that are in contact with opposing sides (i.e., one of the rollers 318 isin contact with the top and one of the rollers 318 is in contact withthe bottom) of the workpiece such that as the workpiece is fed throughthe continuous line fabrication process, the workpiece passes betweenthe rollers 318. The rollers 318 can be heated to thereby heat theworkpiece as the workpiece passes between the rollers 318. Temperatureand pressure parameters for this step were provided above. Thus, in thisexemplary embodiment, the rollers 318 at this stage of the continuousline process are configured to simultaneously 1) heat the workpiece and2) apply pressure to both sides of the workpiece.

As described in conjunction with the description of step 122 of FIG. 1,above, following deposition of the S/Se onto the workpiece a finalanneal is performed. Temperature and pressure parameters for this stepwere provided above. As with the heating steps described above, pressureis applied to the workpiece while the workpiece is heated during thisfinal annealing step. In the exemplary embodiment shown in FIG. 3B, thisheating and simultaneous application of pressure to the workpiece isperformed via rollers 320 that are in contact with opposing sides (i.e.,one of the roller 320 is in contact with the top and one of the roller320 is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the rollers 320. The rollers 320 can be heatedto thereby heat the workpiece as the workpiece passes between therollers 320. Thus, in this exemplary embodiment, the rollers 320 at thisstage of the continuous line process are configured to simultaneously 1)heat the workpiece and 2) apply pressure to both sides of the workpiece.

As shown in FIG. 3B, this final anneal is conducted in a S environment.By way of example only, the workpiece may be fed (in a continuous linefashion) into a sulfurization annealing chamber. The final output is aCIGS panel.

It is notable that the thin film compositions described above, andelsewhere herein are merely examples intended to illustrate the presenttechniques, and a variety of other film compositions can be achieved inthe manner described herein. One would need only to vary the compositionof the materials deposited in one or more of the steps and/or the orderin which the materials are deposited in order to achieve different thinfilm compositions. In addition to the CIGS example provided above, byway of example only, one may adapt the present techniques to produce anyof the following thin film solar cell compositions: CZTS(Cu₂ZnSn(Se,S)₄), FeS₂, Zn₂P₃, CdSe, CdS, ZnSe, WSe₂, MoSe₂, BhS₃, Ag₂S,Cu₂Zn(Fe,Sn)(Se,S)₄, CuxS, CdTe, ZnTe, PbSe, PdS, NiS, NiSeS, InP, ZnO,GaAs. An example involving a I-III-IV₂ material is provided below.

Another exemplary embodiment implementing the present techniques forcontinuous-line fabrication of thin film solar cells is now described byway of reference to FIGS. 4A-B. In FIGS. 4A-B a continuous lineprocessing apparatus is depicted performing the method described in FIG.1, above (i.e., wherein deposition of the various CIGS layers occurs viaelectrodeposition) on a metal (e.g., stainless steel (SS) sheet)substrate. It is to be understood that FIGS. 4A-B illustrate a single,continuous-line apparatus/process, however, for ease and clarity ofdepiction, the figure is broken into two parts (FIG. 4A and FIG. 4B).

As shown in FIG. 4A, a stainless steel substrate is fed into theapparatus between a first set of rollers 402. As compared to the glasssubstrate illustrated in FIGS. 3A-B, a stainless steel metal substrateis more flexible and can be fed through the continuous lineapparatus/process from a roll (as shown in FIG. 4A—labeled “roll ofSS-sheet”). Accordingly, additional rollers may be employed in theproduction line prior to rollers 402 in order to guide the substratefrom the roll. The particular number and positioning of these ‘guide’rollers will of course vary depending on the particular set-up at hand,and their use is optional.

As described in conjunction with the description of step 104 of FIG. 1,above, a Cu layer is deposited onto the substrate while at the same timepressure is applied to both sides (i.e., to a top and bottom) of theworkpiece in order to control volume expansion and stresses on thelayers of the cell. In the embodiment shown in FIG. 4A, this Cudeposition and simultaneous application of pressure to the workpiece isperformed via rollers 402 which as shown in FIG. 4A are in contact withopposing sides (i.e., one of rollers 402 is in contact with the top andone of rollers 402 is in contact with the bottom) of the workpiece suchthat as the workpiece is fed through the continuous line fabricationprocess, the workpiece passes between rollers 402. Further, as shown inFIG. 4A, the rollers 402 are configured to deposit the Cu onto theworkpiece from a Cu-containing electrolyte solution through which one ofthe rollers 402 passes. Namely, according to an exemplary embodiment,rollers 402 are made of a metal such as stainless steel. As the bottomroller 402 passes through the Cu-containing electrolyte solution, the Cuis electrodeposited onto the roller from the electrolyte solution. Inthis example, there is an anode in the electrolyte solution and thebottom (e.g., metal) roller 402 acts as a cathode for theelectrodeposition process. The Cu electrodeposited on the bottom roller402 is then transferred (from the bottom roller 402) onto the workpiece.As described above, the transfer of the Cu from the bottom roller 402 tothe workpiece can be facilitated by cooling the rollers 402. Namely,cooling the rollers will facilitate cladding the Cu to the workpiece,rather than to the (metal) roller itself. Further, due to this being acontinuous line process, as the workpiece passes through each stage, thematerial already deposited and cladded onto the workpiece will aid inremoving the material from the roller (similar to when any sort ofmaterial is unwound from a roll) and cooling the rollers facilitatesremoval of the material from the roll. Thus, in this exemplaryembodiment, the rollers 402 are configured to simultaneously 1) apply Cuto the workpiece and 2) apply pressure to both sides of the workpiece.As described above, the pressure applied to the workpiece by the rollers402 may be based on the weight of the top roller 402 pressing down onthe workpiece against the bottom roller 402, and accordingly the toproller 402 and the bottom roller 402 may not be the same size as oneanother.

As shown in FIG. 4A, a (e.g., nitrogen (N₂)) air knife present in thedirection of rotation between the plating cell and the workpiece servesto direct plating solution from the rollers 402 back into the Cu platingcell. A water jet may also be implemented in the line following the Cudeposition, to clean the workpiece, followed by an air drying step toremove the water.

As described in conjunction with the description of step 106 of FIG. 1,above, in order to bond the Cu deposited onto the substrate material,pressure and heat are applied to the workpiece in step 106. The pressureserves to control volume expansion and stresses on the layers of thecell. In the exemplary embodiment shown in FIG. 4A, this heating andsimultaneous application of pressure to the workpiece is performed viarollers 404 that are in contact with opposing sides (i.e., one of theroller 404 is in contact with the top and one of the roller 404 is incontact with the bottom) of the workpiece such that as the workpiece isfed through the continuous line fabrication process, the workpiecepasses between the rollers 404. The rollers 404 can be heated to therebyheat the workpiece as the workpiece passes between the rollers 404.Temperature and pressure parameters for this step were provided above.Thus, in this exemplary embodiment, the rollers 404 at this stage of thecontinuous line process are configured to simultaneously 1) heat theworkpiece and 2) apply pressure to both sides of the workpiece.

As provided above, electrodeposition is only one exemplary process thatmay be employed herein for depositing the material onto the substrate.For instance, another suitable deposition process (such as sputtering)may be used to deposit the material onto the rollers, which then applythe material to the substrate in the manner described above.Alternatively, the material may be deposited directly onto the substratewith pressure and/or heat being supplied via the rollers as describedabove.

As described in conjunction with the description of step 108 of FIG. 1,above, a In layer is deposited onto the substrate on top of the Cu layerwhile at the same time pressure is applied to both sides (i.e., to a topand bottom) of the workpiece in order to control volume expansion andstresses on the layers of the cell. In the embodiment shown in FIG. 4A,this In deposition and simultaneous application of pressure to theworkpiece is performed via rollers 406 which as shown in FIG. 4A are incontact with opposing sides (i.e., one of rollers 406 is in contact withthe top and one of rollers 406 is in contact with the bottom) of theworkpiece such that as the workpiece is fed through the continuous linefabrication process, the workpiece passes between rollers 406. Further,as shown in FIG. 4A, the rollers 406 are configured to deposit the Inonto the workpiece from an In-containing electrolyte solution throughwhich one of the rollers 406 passes. Namely, as described above, therollers 402 can be made of a metal such as stainless steel and as thebottom roller 406 passes through the In-containing electrolyte solution,the In is electrodeposited onto the roller from the electrolyte solution(i.e., the bottom roller 406 acts as a cathode for the electrodepositionprocess). The In electrodeposited on the bottom roller 406 is thentransferred (from the bottom roller 406) onto the workpiece. Asdescribed above, the transfer of the In from the bottom roller 406 tothe workpiece can be facilitated by cooling the rollers 406—to insurecladding of the In onto the workpiece rather than onto the rollers.Temperature and pressure parameters for this step were provided above.Thus, in this exemplary embodiment, the rollers 406 are configured tosimultaneously 1) apply Cu to the workpiece and 2) apply pressure toboth sides of the workpiece.

As described above, the pressure applied to the workpiece by the rollers406 may be based on the weight of the top roller 406 pressing down onthe workpiece against the bottom roller 406. Accordingly, as providedabove, the rollers 406 may not be the same size as one another.

While not explicitly shown in FIG. 4A, a (e.g., nitrogen (N₂)) air knifemay be present in the direction of rotation between the plating cell andthe workpiece to direct plating solution from the rollers 406 back intothe In plating cell. A water jet may also be implemented in the linefollowing the In deposition, to clean the workpiece, followed by an airdrying step to remove the water. The air knife, water jet and air dryingwould be implemented in the same manner as described above inconjunction with the Cu deposition electroplating stage.

Again, electrodeposition is only one exemplary process that may beemployed herein for depositing the material onto the substrate. Forinstance, another suitable deposition process (such as sputtering) maybe used to deposit the material onto the rollers, which then apply thematerial to the substrate in the manner described above. Alternatively,the material may be deposited directly onto the substrate with pressureand/or heat being supplied via the rollers as described above.

As described in conjunction with the description of step 110 of FIG. 1,above, in order to bond the In deposited onto the substrate material,pressure and heat are applied to the workpiece. The pressure serves tocontrol volume expansion and stresses on the layers of the cell. In theexemplary embodiments shown in FIG. 4A, this heating and simultaneousapplication of pressure to the workpiece is performed via rollers 408that are in contact with opposing sides (i.e., one of the rollers 408 isin contact with the top and one of the rollers 408 is in contact withthe bottom) of the workpiece such that as the workpiece is fed throughthe continuous line fabrication process, the workpiece passes betweenthe rollers 408. The rollers 408 can be heated to thereby heat theworkpiece as the workpiece passes between the rollers 408. Temperatureand pressure parameters for this step were provided above. Thus, in thisexemplary embodiment, the rollers 408 at this stage of the continuousline process are configured to simultaneously 1) heat the workpiece and2) apply pressure to both sides of the workpiece.

As described in conjunction with the description of step 112 of FIG. 1,above, a Ga layer is deposited onto the substrate on top of the In layerwhile at the same time pressure is applied to both sides (i.e., to a topand bottom) of the workpiece in order to control volume expansion andstresses on the layers of the cell. In the embodiment shown in FIG. 4A,this Ga deposition and simultaneous application of pressure to theworkpiece is performed via rollers 410 which as shown in FIG. 4A are incontact with opposing sides (i.e., one of rollers 410 is in contact withthe top and one of rollers 410 is in contact with the bottom) of theworkpiece such that as the workpiece is fed through the continuous linefabrication process, the workpiece passes between rollers 410. Further,as shown in FIG. 4A, the rollers 410 are configured to deposit the Gaonto the workpiece from a Ga-containing electrolyte solution throughwhich one of the rollers 410 passes. Namely, as described above, therollers 410 can be made of a metal such as stainless steel and as thebottom roller 410 passes through the Ga-containing electrolyte solution,the Ga is electrodeposited onto the roller from the electrolyte solution(i.e., the bottom roller 410 acts as a cathode for the electrodepositionprocess). The Ga electrodeposited on the bottom roller 410 is thentransferred (from the bottom roller 410) onto the workpiece. Asdescribed above, the transfer of the Ga from the bottom roller 410 tothe workpiece can be facilitated by cooling the rollers 410—to insurecladding of the Ga onto the workpiece rather than onto the rollers.Temperature and pressure parameters for this step were provided above.Thus, in this exemplary embodiment, the rollers 410 are configured tosimultaneously 1) apply Ga to the workpiece and 2) apply pressure toboth sides of the workpiece.

As described above, the pressure applied to the workpiece by the rollers410 may be based on the weight of the top roller 410 pressing down onthe workpiece against the bottom roller 410. Accordingly, as providedabove, the rollers 410 may not be the same size as one another.

While not explicitly shown in FIG. 4A, a (e.g., nitrogen (N₂)) air knifemay be present in the direction of rotation between the plating cell andthe workpiece to direct plating solution from the rollers 410 back intothe Ga plating cell. A water jet may also be implemented in the linefollowing the Ga deposition, to clean the workpiece, followed by an airdrying step to remove the water. The air knife, water jet and air dryingwould be implemented in the same manner as described above inconjunction with the Cu deposition electroplating stage.

Again, electrodeposition is only one exemplary process that may beemployed herein for depositing the material onto the substrate. Forinstance, another suitable deposition process (such as sputtering) maybe used to deposit the material onto the rollers, which then apply thematerial to the substrate in the manner described above. Alternatively,the material may be deposited directly onto the substrate with pressureand/or heat being supplied via the rollers as described above.

As described in conjunction with the description of step 114 of FIG. 1,above, in order to bond the Ga deposited onto the substrate material,pressure and heat are applied to the workpiece. The pressure serves tocontrol volume expansion and stresses on the layers of the cell. In theexemplary embodiment shown in FIG. 4A, this heating and simultaneousapplication of pressure to the workpiece is performed via rollers 412that are in contact with opposing sides (i.e., one of the rollers 412 isin contact with the top and one of the rollers 412 is in contact withthe bottom) of the workpiece such that as the workpiece is fed throughthe continuous line fabrication process, the workpiece passes betweenthe rollers 412. The rollers 412 can be heated to thereby heat theworkpiece as the workpiece passes between the rollers 412. Temperatureand pressure parameters for this step were provided above. Thus, in thisexemplary embodiment, the rollers 412 at this stage of the continuousline process are configured to simultaneously 1) heat the workpiece and2) apply pressure to both sides of the workpiece.

As described in conjunction with the description of step 116 of FIG. 1,above, following deposition of the Ga onto the workpiece an optionalsoft/intermediate anneal may be performed to enhance the uniformity ofthe final CIGS material. Temperature and pressure parameters for thisstep were provided above. As with the heating steps described above,pressure is applied to the workpiece while the workpiece is heatedduring this soft annealing step. In the exemplary embodiment shown inFIG. 4B, this heating and simultaneous application of pressure to theworkpiece is performed via rollers 414 that are in contact with opposingsides (i.e., one of the rollers 414 is in contact with the top and oneof the rollers 414 is in contact with the bottom) of the workpiece suchthat as the workpiece is fed through the continuous line fabricationprocess, the workpiece passes between the rollers 414. The rollers 414can be heated to thereby heat the workpiece as the workpiece passesbetween the rollers 414. Temperature and pressure parameters for thisstep were provided above. Thus, in this exemplary embodiment, therollers 414 at this stage of the continuous line process are configuredto simultaneously 1) heat the workpiece and 2) apply pressure to bothsides of the workpiece.

As described in conjunction with the description of step 118 of FIG. 1,above, a S and/or Se layer is deposited onto the substrate on top of theGa layer while at the same time pressure is applied to both sides (i.e.,to a top and bottom) of the workpiece in order to control volumeexpansion and stresses on the layers of the cell. In the embodimentshown in FIG. 4B, this S/Se deposition and simultaneous application ofpressure to the workpiece is performed via rollers 416 which as shown inFIG. 4B are in contact with opposing sides (i.e., one of rollers 416 isin contact with the top and one of rollers 416 is in contact with thebottom) of the workpiece such that as the workpiece is fed through thecontinuous line fabrication process, the workpiece passes betweenrollers 416. Further, as shown in FIG. 4B, the rollers 416 areconfigured to deposit the S/Se onto the workpiece from a S/Se-containingelectrolyte solution through which one of the rollers 416 passes.Namely, as described above, the rollers 416 can be made of a metal suchas stainless steel and as the bottom roller 416 passes through theS/Se-containing electrolyte solution, the S/Se is electrodeposited ontothe roller from the electrolyte solution (i.e., the bottom roller 316acts as a cathode for the electrodeposition process). The S/Seelectrodeposited on the bottom roller 416 is then transferred (from thebottom roller 416) onto the workpiece. As described above, the transferof the S/Se from the bottom roller 416 to the workpiece can befacilitated by cooling the rollers 416—to insure cladding of the S/Seonto the workpiece rather than onto the rollers. Temperature andpressure parameters for this step were provided above. Thus, in thisexemplary embodiment, the rollers 416 are configured tosimultaneously 1) apply S/Se to the workpiece and 2) apply pressure toboth sides of the workpiece.

As described above, the pressure applied to the workpiece by the rollers416 may be based on the weight of the top roller 416 pressing down onthe workpiece against the bottom roller 416. Accordingly, as providedabove, the rollers 416 may not be the same size as one another.

While not explicitly shown in FIG. 4B, a (e.g., nitrogen (N₂)) air knifemay be present in the direction of rotation between the plating cell andthe workpiece to direct plating solution from the rollers 416 back intothe S/Se plating cell. A water jet may also be implemented in the linefollowing the S/Se deposition, to clean the workpiece, followed by anair drying step to remove the water. The air knife, water jet and airdrying would be implemented in the same manner as described above inconjunction with the Cu deposition electroplating stage.

Again, electrodeposition is only one exemplary process that may beemployed herein for depositing the material onto the substrate. Forinstance, another suitable deposition process (such as sputtering) maybe used to deposit the material onto the rollers, which then apply thematerial to the substrate in the manner described above. Alternatively,the material may be deposited directly onto the substrate with pressureand/or heat being supplied via the rollers as described above.

As described in conjunction with the description of step 120 of FIG. 1,above, in order to bond the S/Se deposited onto the substrate material,pressure and heat are applied to the workpiece. The pressure serves tocontrol volume expansion and stresses on the layers of the cell. In theexemplary embodiment shown in FIG. 4B, this heating and simultaneousapplication of pressure to the workpiece is performed via rollers 418that are in contact with opposing sides (i.e., one of the rollers 418 isin contact with the top and one of the rollers 418 is in contact withthe bottom) of the workpiece such that as the workpiece is fed throughthe continuous line fabrication process, the workpiece passes betweenthe rollers 418. The rollers 418 can be heated to thereby heat theworkpiece as the workpiece passes between the rollers 418. Temperatureand pressure parameters for this step were provided above. Thus, in thisexemplary embodiment, the rollers 418 at this stage of the continuousline process are configured to simultaneously 1) heat the workpiece and2) apply pressure to both sides of the workpiece.

As described in conjunction with the description of step 122 of FIG. 1,above, following deposition of the S/Se onto the workpiece final annealis performed. Temperature and pressure parameters for this step wereprovided above. As with the heating steps described above, pressure isapplied to the workpiece while the workpiece is heated during this finalannealing step. In the exemplary embodiment shown in FIG. 4B, thisheating and simultaneous application of pressure to the workpiece isperformed via rollers 420 that are in contact with opposing sides (i.e.,one of the rollers 420 is in contact with the top and one of the rollers420 is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the rollers 420. The rollers 420 can be heatedto thereby heat the workpiece as the workpiece passes between therollers 420. Thus, in this exemplary embodiment, the rollers 420 at thisstage of the continuous line process are configured to simultaneously 1)heat the workpiece and 2) apply pressure to both sides of the workpiece.

As shown in FIG. 4B, this final anneal is conducted in a S/Seenvironment. By way of example only, the workpiece may be fed (in acontinuous line fashion) into a sulfurization annealing chamber. Thefinal output is a CIGS panel.

Yet another exemplary embodiment implementing the present techniques forcontinuous-line fabrication of thin film solar cells is now described byway of reference to FIGS. 5A-B. In FIGS. 5A-B a continuous lineprocessing apparatus is depicted performing the method described in FIG.2, above (i.e., wherein deposition of the various CIGS layers occurs viaelectrodeposition and/or via deposition from a molten bath) on a metal(e.g., stainless steel (SS) sheet) substrate. It is to be understoodthat FIGS. 5A-B illustrate a single, continuous-line apparatus/process,however, for ease and clarity of depiction, the figure is broken intotwo parts (FIG. 5A and FIG. 5B). By contrast with the embodiments shownillustrated in FIGS. 3A-B and 4A-B, in FIGS. 5A-B some of the CIGSlayers are deposited onto the workpiece from a molten bath rather thanvia an electroplating cell.

As shown in FIG. 5A, a stainless steel substrate is fed into theapparatus between a first set of rollers 502. As compared to the glasssubstrate illustrated in FIGS. 3A-B, a stainless steel metal substrateis more flexible and can be fed through the continuous lineapparatus/process from a roll (as shown in FIG. 5A—labeled “roll ofSS-sheet”). Accordingly, additional rollers may be employed in theproduction line prior to rollers 502 in order to guide the substratefrom the roll. The particular number and positioning of these ‘guide’rollers will of course vary depending on the particular set-up at hand,and their use is optional.

As described in conjunction with the description of step 204 of FIG. 2,above, a Cu layer is deposited onto the substrate while at the same timepressure is applied to both sides (i.e., to a top and bottom) of theworkpiece in order to control volume expansion and stresses on thelayers of the cell. In the embodiment shown in FIG. 5A, this Cudeposition and simultaneous application of pressure to the workpiece isperformed via rollers 502 which as shown in FIG. 5A are in contact withopposing sides (i.e., one of rollers 502 is in contact with the top andone of rollers 502 is in contact with the bottom) of the workpiece suchthat as the workpiece is fed through the continuous line fabricationprocess, the workpiece passes between rollers 502. Further, as shown inFIG. 5A, the rollers 502 are configured to deposit the Cu onto theworkpiece from a Cu-containing electrolyte solution through which one ofthe rollers 502 passes. Namely, according to an exemplary embodiment,rollers 502 are made of a metal such as stainless steel. As the bottomroller 502 passes through the Cu-containing electrolyte solution, the Cuis electrodeposited onto the roller from the electrolyte solution. Inthis example, there is an anode in the electrolyte solution and thebottom (e.g., metal) roller 502 acts as a cathode for theelectrodeposition process. The Cu electrodeposited on the bottom roller502 is then transferred (from the bottom roller 502) onto the workpiece.As described above, the transfer of the Cu from the bottom roller 502 tothe workpiece can be facilitated by cooling the rollers 502. Namely,cooling the rollers will facilitate cladding the Cu to the workpiece,rather than to the (metal) roller itself. Further, due to this being acontinuous line process, as the workpiece passes through each stage, thematerial already deposited and cladded onto the workpiece will aid inremoving the material from the roller (similar to when any sort ofmaterial is unwound from a roll) and cooling the rollers facilitatesremoval of the material from the roll. Temperature and pressureparameters for this step were provided above. Thus, in this exemplaryembodiment, the rollers 502 are configured to simultaneously 1) apply Cuto the workpiece and 2) apply pressure to both sides of the workpiece.As described above, the pressure applied to the workpiece by the rollers502 may be based on the weight of the top roller 502 pressing down onthe workpiece against the bottom roller 502, and accordingly the toproller 502 and the bottom roller 502 may not be the same size as oneanother.

As shown in FIG. 5A, a (e.g., nitrogen (N₂)) air knife present in thedirection of rotation between the plating cell and the workpiece servesto direct plating solution from the rollers 502 back into the cu platingcell. A water jet may also be implemented in the line following the Cudeposition, to clean the workpiece, followed by an air drying step toremove the water.

As provided above, electrodeposition is only one exemplary process thatmay be employed herein for depositing the material onto the substrate.For instance, another suitable deposition process (such as sputtering)may be used to deposit the material onto the rollers, which then applythe material to the substrate in the manner described above.Alternatively, the material may be deposited directly onto the substratewith pressure and/or heat being supplied via the rollers as describedabove.

As described in conjunction with the description of step 206 of FIG. 2,above, in order to bond the Cu deposited onto the substrate material,pressure and heat are applied to the workpiece in step 206. The pressureserves to control volume expansion and stresses on the layers of thecell. In the exemplary embodiment shown in FIG. 5A, this heating andsimultaneous application of pressure to the workpiece is performed viarollers 504 that are in contact with opposing sides (i.e., one of theroller 504 is in contact with the top and one of the roller 504 is incontact with the bottom) of the workpiece such that as the workpiece isfed through the continuous line fabrication process, the workpiecepasses between the rollers 504. The rollers 504 can be heated to therebyheat the workpiece as the workpiece passes between the rollers 504.Temperature and pressure parameters for this step were provided above.Thus, in this exemplary embodiment, the rollers 504 at this stage of thecontinuous line process are configured to simultaneously 1) heat theworkpiece and 2) apply pressure to both sides of the workpiece.

As described in conjunction with the description of step 208 of FIG. 2,above, a In layer is deposited onto the substrate on top of the Cu layerwhile at the same time pressure is applied to both sides (i.e., to a topand bottom) of the workpiece in order to control volume expansion andstresses on the layers of the cell. In the embodiment shown in FIG. 5A,this In deposition and simultaneous application of pressure to theworkpiece is performed via rollers 506 which as shown in FIG. 5A are incontact with opposing sides (i.e., one of rollers 506 is in contact withthe top and one of rollers 506 is in contact with the bottom) of theworkpiece such that as the workpiece is fed through the continuous linefabrication process, the workpiece passes between rollers 506. Further,as shown in FIG. 5A, the rollers 506 are configured to deposit the Inonto the workpiece from a bath of molten In through which one of therollers 506 passes. Namely, as the bottom roller 506 passes through thebath, some of the molten In is picked up by the roller and transferredto the workpiece. As described above, the transfer of the In from thebottom roller 506 to the workpiece can be facilitated by cooling therollers 506. Temperature and pressure parameters for this step wereprovided above. Thus, in this exemplary embodiment, the rollers 506 areconfigured to simultaneously 1) apply In to the workpiece and 2) applypressure to both sides of the workpiece.

As described above, the pressure applied to the workpiece by the rollers506 may be based on the weight of the top roller 506 pressing down onthe workpiece against the bottom roller 506. Accordingly, as providedabove, the rollers 506 may not be the same size as one another. As shownin FIG. 5A, a doctor blade may be present in the direction of rotationbetween the molten In bath and the workpiece to direct molten In fromthe rollers 506 back into the molten In bath.

As described in conjunction with the description of step 210 of FIG. 2,above, the In material deposited on the workpiece from the molten bathwill still be (at least to some extent) molten after it is transferredto the workpiece. Thus, the workpiece is cooled. In order to controlvolume expansion and stresses on the layers of the cell, pressure isapplied to both sides (i.e., to a top and bottom) of the workpieceduring this cooling step. In the exemplary embodiment shown in FIG. 5A,this cooling and simultaneous application of pressure to the workpieceis performed via rollers 508 that are in contact with opposing sides(i.e., one of the rollers 508 is in contact with the top and one of therollers 508 is in contact with the bottom) of the workpiece such that asthe workpiece is fed through the continuous line fabrication process,the workpiece passes between the rollers 508. The rollers 508 can becooled to thereby cool the workpiece as the workpiece passes between therollers 508. Temperature and pressure parameters for this step wereprovided above. Thus, in this exemplary embodiment, the rollers 508 atthis stage of the continuous line process are configured tosimultaneously 1) cool the workpiece and 2) apply pressure to both sidesof the workpiece.

As described in conjunction with the description of step 212 of FIG. 2,above, a Ga layer is deposited onto the substrate on top of the In layerwhile at the same time pressure is applied to both sides (i.e., to a topand bottom) of the workpiece in order to control volume expansion andstresses on the layers of the cell. In the embodiment shown in FIG. 5A,this Ga deposition and simultaneous application of pressure to theworkpiece is performed via rollers 510 which as shown in FIG. 5A are incontact with opposing sides (i.e., one of rollers 510 is in contact withthe top and one of rollers 510 is in contact with the bottom) of theworkpiece such that as the workpiece is fed through the continuous linefabrication process, the workpiece passes between rollers 510. Further,as shown in FIG. 5A, the rollers 510 are configured to deposit the Gaonto the workpiece from a bath of molten Ga through which one of therollers 510 passes. Namely, as the bottom roller 510 passes through thebath, some of the molten Ga is picked up by the roller and transferredto the workpiece. As described above, the transfer of the Ga from thebottom roller 510 to the workpiece can be facilitated by cooling therollers 510—to insure cladding of the Ga onto the workpiece rather thanonto the rollers. Temperature and pressure parameters for this step wereprovided above. Thus, in this exemplary embodiment, the rollers 510 areconfigured to simultaneously 1) apply Ga to the workpiece and 2) applypressure to both sides of the workpiece.

As described above, the pressure applied to the workpiece by the rollers510 may be based on the weight of the top roller 510 pressing down onthe workpiece against the bottom roller 510. Accordingly, as providedabove, the rollers 510 may not be the same size as one another. As shownin FIG. 5A, a doctor blade may be present in the direction of rotationbetween the molten Ga bath and the workpiece to direct molten Ga fromthe rollers 510 back into the molten Ga bath.

As described in conjunction with the description of step 214 of FIG. 2,above, the Ga material deposited on the workpiece from the molten bathwill still be (at least to some extent) molten after it is transferredto the workpiece. Thus, the workpiece is cooled. In order to controlvolume expansion and stresses on the layers of the cell, pressure isapplied to both sides (i.e., to a top and bottom) of the workpieceduring this cooling step. In the exemplary embodiment shown in FIG. 5A,this cooling and simultaneous application of pressure to the workpieceis performed via rollers 512 that are in contact with opposing sides(i.e., one of the rollers S12 is in contact with the top and one of therollers 512 is in contact with the bottom) of the workpiece such that asthe workpiece is fed through the continuous line fabrication process,the workpiece passes between the rollers 512. The rollers 512 can becooled to thereby cool the workpiece as the workpiece passes between therollers 512. Temperature and pressure parameters for this step wereprovided above. Thus, in this exemplary embodiment, the rollers 512 atthis stage of the continuous line process are configured tosimultaneously 1) cool the workpiece and 2) apply pressure to both sidesof the workpiece.

As described in conjunction with the description of step 216 of FIG. 2,above, following deposition of the Ga onto the workpiece an optionalsoft/intermediate anneal may be performed to enhance the uniformity ofthe final CIGS material. Temperature and pressure parameters for thisstep were provided above. As with the heating steps described above,pressure is applied to the workpiece while the workpiece is heatedduring this soft annealing step. In the exemplary embodiment shown inFIG. 5B, this heating and simultaneous application of pressure to theworkpiece is performed via rollers 514 that are in contact with opposingsides (i.e., one of the rollers 514 is in contact with the top and oneof the rollers 514 is in contact with the bottom) of the workpiece suchthat as the workpiece is fed through the continuous line fabricationprocess, the workpiece passes between the rollers 514. The rollers 514can be heated to thereby heat the workpiece as the workpiece passesbetween the rollers 514. Temperature and pressure parameters for thisstep were provided above. Thus, in this exemplary embodiment, therollers 514 at this stage of the continuous line process are configuredto simultaneously 1) heat the workpiece and 2) apply pressure to bothsides of the workpiece.

As described in conjunction with the description of step 218 of FIG. 2,above, a S and/or Se layer is deposited onto the substrate on top of theGa layer while at the same time pressure is applied to both sides (i.e.,to a top and bottom) of the workpiece in order to control volumeexpansion and stresses on the layers of the cell. In the embodimentshown in FIG. 5B, this S/Se deposition and simultaneous application ofpressure to the workpiece is performed via rollers 516 which as shown inFIG. 5B are in contact with opposing sides (i.e., one of rollers 516 isin contact with the top and one of rollers 516 is in contact with thebottom) of the workpiece such that as the workpiece is fed through thecontinuous line fabrication process, the workpiece passes betweenrollers 516. Further, as shown in FIG. 5B, the rollers 516 areconfigured to deposit the S/Se onto the workpiece from a bath of moltenS/Se through which one of the rollers 516 passes. Namely, as the bottomroller 516 passes through the bath, some of the molten S/Se is picked upby the roller and transferred to the workpiece. As described above, thetransfer of the S/Se from the bottom roller 516 to the workpiece can befacilitated by cooling the rollers 516—to insure cladding of the S ontothe workpiece rather than onto the rollers. Temperature and pressureparameters for this step were provided above. Thus, in this exemplaryembodiment, the rollers 516 are configured to simultaneously 1) applyS/Se to the workpiece and 2) apply pressure to both sides of theworkpiece.

As described above, the pressure applied to the workpiece by the rollers516 may be based on the weight of the top roller S16 pressing down onthe workpiece against the bottom roller 516. Accordingly, as providedabove, the rollers 516 may not be the same size as one another. As shownin FIG. 5B, a doctor blade may be present in the direction of rotationbetween the molten S/Se bath and the workpiece to direct molten S/Sefrom the rollers 516 back into the molten S/Se bath.

As described in conjunction with the description of step 220 of FIG. 2,above, the S/Se material deposited on the workpiece from the molten bathwill still be (at least to some extent) molten after it is transferredto the workpiece. Thus, the workpiece is cooled. In order to controlvolume expansion and stresses on the layers of the cell, pressure isapplied to both sides (i.e., to a top and bottom) of the workpieceduring this cooling step. In the exemplary embodiment shown in FIG. 5B,this cooling and simultaneous application of pressure to the workpieceis performed via rollers 518 that are in contact with opposing sides(i.e., one of the rollers 518 is in contact with the top and one of therollers 518 is in contact with the bottom) of the workpiece such that asthe workpiece is fed through the continuous line fabrication process,the workpiece passes between the rollers 518. The rollers 518 can becooled to thereby cool the workpiece as the workpiece passes between therollers 518. Temperature and pressure parameters for this step wereprovided above. Thus, in this exemplary embodiment, the rollers 518 atthis stage of the continuous line process are configured tosimultaneously 1) cool the workpiece and 2) apply pressure to both sidesof the workpiece.

As described in conjunction with the description of step 222 of FIG. 2,above, following deposition of the S/Se onto the workpiece final annealis performed. Temperature and pressure parameters for this step wereprovided above. As with the heating steps described above, pressure isapplied to the workpiece while the workpiece is heated during this finalannealing step. In the exemplary embodiment shown in FIG. 5B, thisheating and simultaneous application of pressure to the workpiece isperformed via rollers 520 that are in contact with opposing sides (i.e.,one of the rollers 520 is in contact with the top and one of the rollers520 is in contact with the bottom) of the workpiece such that as theworkpiece is fed through the continuous line fabrication process, theworkpiece passes between the rollers 520. The rollers 520 can be heatedto thereby heat the workpiece as the workpiece passes between therollers 520. Thus, in this exemplary embodiment, the rollers 520 at thisstage of the continuous line process are configured to simultaneously 1)heat the workpiece and 2) apply pressure to both sides of the workpiece.

As shown in FIG. 5B, this final anneal is conducted in a S environment.By way of example only, the workpiece may be fed (in a continuous linefashion) into a sulfurization annealing chamber. The final output is aCIGS panel.

FIG. 6 is an exemplary drive system for turning the rollers and therebyadvancing the workpiece throughout the present continuous-lineprocessing apparatus. As provided above, this drive system may beimplemented in any of the apparatus embodiments shown and describedabove. As shown in FIG. 6, the drive system includes a first roller 602that is motor-driven. For illustrative purposes, the first roller 602 isshown to be turning in a clockwise direction. The first roller 602 is inphysical contact with one (i.e., roller 604) of a set of rollers. Byturning in a clockwise direction, the roller 602 turns the roller 604 ina counterclockwise direction. Both of the sets of rollers 604 and 606are in physical contact with the workpiece 608. In having the roller 604turn in a counterclockwise direction, the workpiece 608 is advanced(from left to right in the depiction shown). Movement of the workpieceturns the roller 606 in a clockwise direction. As provided above, thesets of rollers (in this case roller 604 and roller 606, also serve toapply pressure to the workpiece, heat/cool the workpiece, and apply filmmaterial to the workpiece. The function of applying pressure (alsotermed “roll-to-roll pressure—since the pressure is being applied by thetwo rollers between which the workpiece passes) is now described.

According to one exemplary embodiment, the rollers are constructed ofmetal and the pressure applied to the workpiece is supplied based on theweight of the roller on the workpiece. For instance, in the exampleshown in FIG. 6, the top roller 604 can be configured to have a weightsuch that the force of roller 604 on the workpiece against roller 606provides the specified amount of pressure (see above) on the workpiece.Accordingly, the size (i.e., diameter) of the top roller can beconfigured such that the roller has a certain weight and thus appliesthe desired amount of pressure to the workpiece. This is illustrated inFIG. 6 where the size (i.e., diameter) of roller 604 is less than thatof roller 606.

It is notable that while the drive system shown in FIG. 6 may be fittedto each set of rollers in the apparatus, this might not be necessary asdriving (e.g., only one or two sets of rollers) may be sufficient tofeed the workpiece through the apparatus. According to an exemplaryembodiment, only the first set of rollers in the apparatus is powered(motor-driven).

In the examples provided above, deposition of the thin film materials(e.g., Cu, In, Ga, S/Se, etc.) onto the rollers occurs viaelectrodeposition and/or passage through a molten bath. Other depositionprocesses may however be employed in accordance with the presenttechniques. For instance, as shown in FIG. 7, a deposition process, suchas spraying, sputtering, and chemical vapor deposition, may be used todeposit the thin film material 706 onto roller 702, which in turn thentransfers the material to a substrate 708 under pressure and/orheating/cooling in the manner described above. The rollers 702 and 704depicted in FIG. 7 generally represent any of the above-describedrollers used to apply pressure and/or heat/cool the substrate duringthin film deposition. Similarly, the material 706 shown being depositedonto the roller 702 in FIG. 7 generally represents any of the materialsdescribed herein for use in the thin film solar cell fabrication processaccording to the present techniques. The substrate 708 shown in FIG. 7generally represents any of the (e.g., Mo-coated glass, metal, etc.)substrates described herein which, depending on the particular stage ofproduction, may have one or more layers of thin films already depositedthereon. It is further noted, that combinations of the teachingsprovided herein can be implemented, if so desired. For instance, one ormore of the materials can be deposited via the rollers usingelectrodeposition and/or transfer from a molten bath (as providedabove), and one or more other materials can be deposited via thematerials being sprayed, etc. on the rollers (as shown in FIG. 7).

Alternatively, as shown in FIG. 8, one or more of the thin filmmaterials (e.g., Cu, In, Ga, S/Se, etc.—see above) can be depositeddirectly onto a substrate and the above-described pressure and/orheating/cooling applied via the rollers. The rollers 802 and 804depicted in FIG. 8 generally represent any of the above-describedrollers used to apply pressure and/or heat/cool the substrate duringthin film deposition. Similarly, the material 806 shown being depositedonto the substrate 808 in FIG. 8 generally represents any of thematerials described herein for use in the thin film solar cellfabrication process according to the present techniques. The substrate808 shown in FIG. 8 generally represents any of the (e.g., Mo-coatedglass, metal, etc.) substrates described herein which, depending on theparticular stage of production, may have one or more layers of thinfilms already deposited thereon. In this example, any suitabledeposition process can be used to deposit the material onto thesubstrate, including but not limited to spraying, sputtering, andchemical vapor deposition. Further, as shown in FIG. 8, since therollers will be used to apply pressure, heat, etc., then the materialshould be deposited onto the substrate prior to the substrate passingbetween the rollers.

The thin film materials described above are examples provided merely toillustrate the present techniques, and a variety of other filmcompositions can be achieved in the same manner described herein. Onewould need only to vary the composition of the materials deposited inone or more of the steps and/or the order in which the materials aredeposited in order to achieve different solar cell (or any other device)configurations. By way of example only, one may adapt the presenttechniques to produce any of the following thin film solar cellcompositions: CIGS, CZTS (Cu₂ZnSn(Se,S)₄), FeS₂, Zn₂P₃, CdSe, CdS, ZnSe,WSe₂, MoSe₂, Bi₂S₃, Ag₂S, Cu₂Zn(Fe,Sn)(Se,S)₄, CuxS, CdTe, ZnTe, PbSe,PdS, NiS, NiSeS, InP, ZnO, GaAs.

For instance, in one exemplary implementation of the present techniques,a I-III-IV2 thin film solar cell is produced. As is known in the art, aI-III-IV2 material includes at least one from group I element, at leastone group III element, and at least one group IV element. By way ofexample only, some I-III-IV₂ materials include, but are not limited to,CuAlGe₂, CuGaGe₂, CuAlSn₂, and CuGaSn₂. Using CuGaSn₂ as an example, thepresent techniques can be employed to deposit Cu to the substrate,followed by Ga, and finally tin (Sn) all while pressure is applied viathe rollers in the manner described above.

Although illustrative embodiments of the present invention have beendescribed herein, it is to be understood that the invention is notlimited to those precise embodiments, and that various other changes andmodifications may be made by one skilled in the art without departingfrom the scope of the invention.

What is claimed is:
 1. An apparatus for fabricating a thin film solarcell, the apparatus comprising: a set of rollers (a) configured to, whena substrate passes between the set of rollers (a), deposit a firstabsorber material as a layer A on the substrate while applying pressureto both the substrate and the layer A; a set of rollers (b) configuredto, when the substrate with the layer A thereon passes through the setof rollers (b), deposit a second absorber material as a layer B on thelayer A while applying pressure to both the substrate and the layer B; aset of rollers (c) configured to, when the substrate with the layers Aand B thereon passes through the set of rollers (c), deposit a thirdabsorber material as a layer C on the layer B while applying pressure toboth the substrate and the layer C; a set of rollers (d) configured to,when the substrate with the layers A-C thereon passes through the set ofrollers (d), deposit a fourth absorber material as a layer D on thelayer C while applying pressure to both the substrate and the layer D;and a set of rollers (e) configured to, when the substrate with thelayers A-D thereon passes through the set of rollers (e), anneal thelayers A-D while applying pressure to both the substrate and the layerD, wherein the first absorber material comprises copper, the secondabsorber material comprises indium, the third absorber materialcomprises gallium, and the fourth absorber material comprises one ormore of sulfur and selenium, and wherein the apparatus is configured toform a chalcogenide absorber layer on the substrate.
 2. The apparatus ofclaim 1, further comprising: a set of rollers (f) configured to, whenthe substrate with the layers A-C thereon passes through the set ofrollers (f), soft anneal the layers A-C while applying pressure to boththe substrate and the layer C.
 3. The apparatus of claim 1, wherein theset of rollers (a) are configured to deposit the layer A from a chemicalor electrochemical solution, the apparatus further comprising: a set ofrollers (g) which following deposition of the first absorber material onthe substrate is configured to, when the substrate with the layer Athereon passes through the set of rollers (g), heat the layer A whileapplying pressure to both the substrate and the layer A.
 4. Theapparatus of claim 1, wherein the set of rollers (b) are configured todeposit the layer B from a chemical or electrochemical solution, theapparatus further comprising: a set of rollers (h) which followingdeposition of the layer B on the layer A is configured to, when thesubstrate with the layers A and B thereon passes through the set ofrollers (h), heat the layer B while applying pressure to both thesubstrate and the layer B.
 5. The apparatus of claim 1, wherein the setof rollers (b) are configured to deposit the layer B from a molten bath,the apparatus further comprising: a set of rollers (h) which followingdeposition of the layer B on the layer A is configured to, when thesubstrate with the layers A and B thereon passes through the set ofrollers (h), cool the layer B while applying pressure to both thesubstrate and the layer B.
 6. The apparatus of claim 1, wherein the setof rollers (c) are configured to deposit the layer C from a chemical orelectrochemical solution, the apparatus further comprising: a set ofrollers (i) which following deposition of the layer C on the layer B isconfigured to, when the substrate with the layers A-C thereon passesthrough the set of rollers (i), heat the layer C while applying pressureto both the substrate and the layer C.
 7. The apparatus of claim 1,wherein the set of rollers (c) are configured to deposit the layer Cfrom a molten bath, the apparatus further comprising: a set of rollers(i) which following deposition of the layer C on the layer B isconfigured to, when the substrate with the layers A-C thereon passesthrough the set of rollers (i), cool the layer C while applying pressureto both the substrate and the layer C.
 8. The apparatus of claim 1,wherein the set of rollers (d) are configured to deposit the layer Dfrom a chemical or electrochemical solution, the apparatus furthercomprising: a set of rollers G) which following deposition of the layerD on the layer C is configured to, when the substrate with the layersA-D thereon passes through the set of rollers G), heat the layer D whileapplying pressure to both the substrate and the layer D.
 9. Theapparatus of claim 1, wherein the set of rollers (d) are configured todeposit the layer D from a molten bath, the apparatus furthercomprising: a set of rollers G) which following deposition of the layerD on the layer C is configured to, when the substrate with the layersA-D thereon passes through the set of rollers G), cool the layer D whileapplying pressure to both the substrate and the layer D.